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This is a WORK IN PROGRESS!


Ownership and License

The contributors are listed in CONTRIB.TXT.

Introduction

test mainboard

EEZ BB3+ was conceived as a successor to the BB3 project, which would bring a number of modifications and improvements. The following modifications are planned:

  • Combining 3 existing core modules (power supply, MCU and backplane) into a single one
  • Enlarge TFT touchscreen from 4.3" (480x272) resistive to 5" (800x480) capacitive
  • Increase fan size from Ø80 to 92 mm
  • Replace existing micro SD card with chip version (NAND Flash)
  • Single main power rail +12V (45/60 W + AUX connector for up to 150 W of additional power)
  • Introducing half width modules and increasing the total number of modules from 3 full-width to 5 half-width (or two 1½-width)
  • TFT Display PCB with up to 4 user switch/hot keys

Planned new features of BB3+:

  • Max. 5 peripheral modules
  • Soft-power switch with standby indication
  • RS485 port (with Modbus support)
  • Power/Sense terminals for the first two modules on the rear panel
  • MCU/CPU module slot Raspberry Pi CM5 compatible
  • M.2 slot, Key M (for NVMe SSD)
  • External display output (e.g. HDMI® or DisplayPort™ compatible): GUI and data could be displayed simultaneously on TFT and external display
  • 2.0/3.0 USB Hub
  • 10/100/1000 Mbit Ethernet port
  • New DIB specification for peripheral modules communication introducing QSPI, USB 2.0/3.0 and PCIe
  • CE certified design

Modules

  • 5" TFT module (HDMI® compatible input, capacitive or optional resistive touchscreen)

Experimental designs

During development, several prototypes will be used for features planned for BB3+. Information about them can be found in the Experimental subfolder.

Related topics and links


This work is financed by NLnet foundation

nlnet

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EEZ Bench Box 3 Plus (BB3+) Modular T&M chassis

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